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october 2010 doc id 8002 rev 4 1/12 12 stps30l45c low drop power schottky rectifier features low forward voltage drop meaning very small conduction losses low switching losses allowing high frequency operation low thermal resistance avalanche rated insulated pack age to-220fpab: ? insulating voltage = 2000 v dc ? capacitance = 45 pf avalanche capability specified description dual center tap schottky rectifier suited for switched mode power supplies and high frequency dc to dc converters. packaged in to-247, to-220ab, to-220fpab, d 2 pak and i 2 pak this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. table 1. device summary i f(av) 2 x 15 a v rrm 45 v t j (max) 150 c v f (max) 0.5 v a1 k a2 k a1 a2 k a1 a2 k a1 a2 k a1 a2 a1 a2 k to-247 stps30l45cw to-220fpab stps30l45cfp d 2 pak stps30l45cg to-220ab stps30l45ct i 2 pa k stps30l45cr www.st.com
characteristics stps30l45c 2/12 doc id 8002 rev 4 1 characteristics when the diodes 1 and 2 are used simultaneously: t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms current 30 a i f(av) average forward current to-220fpab t c =110 c, = 0.5 per diode per device 15 30 a to-220ab, to-247, i 2 pak, d 2 pa k t c = 135 c, = 0.5 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 220 a i rrm repetitive peak reverse current t p = 2 s square f = 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 3 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 6000 w t stg storage temperature range -65 to + 150 c t j maximum operating junction temperature (1) 150 c dv/dt critical rate of rise of reverse voltage 10000 v/s 1. condition to avoid thermal runaway for a diode on its own heatsink d ptot dtj - -------------- 1 rth j a ? () ------------------------- - < table 3. thermal resistances symbol parameter value unit r th(j-c) junction to case to-220fpab per diode to t a l 4 3.2 c/w to-220ab, to-247, i 2 pak, d 2 pa k per diode to t a l 1.60 0.85 r th(c) coupling to-220fpab 2.5 c/w to-220ab, to-247, i 2 pak, d 2 pa k 0 . 1 0
stps30l45c characteristics doc id 8002 rev 4 3/12 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 0.4 ma t j = 125 c 100 200 ma v f (1) forward voltage drop t j = 25 c i f = 15 a 0.55 v t j = 125 c i f = 15 a 0.42 0.50 t j = 25 c i f = 30 a 0.74 t j = 125 c i f = 30 a 0.59 0.67 1. pulse test: tp = 380 s, < 2% to evaluate the conduction losses use the following equation: p = 0.330 x i f(av) + 0.011 i f 2 (rms) figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( = 0.5, per diode) 02468101214161820 0 2 4 6 8 10 12 if(av) (a) pf(av)(w) t =tp/t tp = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 tamb(c) if(av)(a) rth(j-a)=15c/w rth(j-a)=rth(j-c) to-220fpab to-220ab/to-247/i2pak/d2pak t =tp/t tp figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm
characteristics stps30l45c 4/12 doc id 8002 rev 4 figure 5. non repetitive surge peak forward current versus overload duration figure 6. non repetitive surge peak forward current versus overload duration (to-220fpab only) 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 160 180 200 t(s) i m (a) tc=25c tc=125c tc=75c i m t =0.5 maximum values, per diode 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 t(s) i m (a) tc=25c tc=125c tc=75c i m t =0.5 maximum values, per diode figure 7. relative variation of thermal impedance junction to case versus pulse duration figure 8. relative variation of thermal impedance junction to case versus pulse duration (to-220fpab) 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) = 0.5 = 0.2 = 0.1 single pulse t =tp/t tp 1e-3 1e-2 1e-1 1e+0 1e+ 1 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) t =tp/t tp = 0.5 = 0.2 = 0.1 single pulse figure 9. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 10. junction capacitance versus reverse voltage applied (typical values, per diode) 0 5 10 15 20 25 30 35 40 45 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 vr(v) ir(ma) tj=100c tj=75c tj=25c tj=150c tj=125c 12 51020 50 100 200 500 1000 2000 vr(v) c(pf) f=1mhz tj=25c
stps30l45c characteristics doc id 8002 rev 4 5/12 figure 11. forward voltage drop versus forward current (maximum values, per diode) figure 12. thermal resistance junction to ambient versus copper surface under tab for d 2 pak 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1 10 100 200 vfm(v) ifm(a) typical values tj=150c tj=25c tj=125c 0 5 10 15 20 25 30 35 40 0 10 20 30 40 50 60 70 80 s(cm2) rth(j-a) (c/w) epoxy printed circuit board fp4, copper thickness = 35 m
package information stps30l45c 6/12 doc id 8002 rev 4 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque (to-220ab, to-220fpab): 0.4 to 0.6 nm in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. to-220ab package dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. dia. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
stps30l45c package information doc id 8002 rev 4 7/12 mounting (soldering) the i 2 pak metal slug (heatsink) with alloy, like a surface mount device, is not permitted. a standard through-hole mounting is mandatory. table 6. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
package information stps30l45c 8/12 doc id 8002 rev 4 table 7. to-220fpab package dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
stps30l45c package information doc id 8002 rev 4 9/12 figure 13. d 2 pak footprint dimensions (in millimeters) table 8. d 2 pak package dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
package information stps30l45c 10/12 doc id 8002 rev 4 table 9. to-247 dimensions ref. dimensions millimeters inches min. max. min. max. a 4.85 5.15 0.191 0.203 a1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 d (1) 1. dimension d plus gate protrusion does not exceed 20.5 mm 19.85 20.15 0.781 0.793 e 15.45 15.75 0.608 0.620 e 5.45 typ. 0.215 typ. l 14.20 14.80 0.559 0.582 l1 3.70 4.30 0.145 0.169 l2 18.50 typ. 0.728 typ. ? p (2) 2. resin thickness around the mounti ng hole is not less than 0.9 mm 3.55 3.65 0.139 0.143 ? r 4.50 5.50 0.177 0.217 s 5.50 typ. 0.216 typ. e l2 s d c a1 back view heat-sink plane l1 l b1 b2 b a e 1 1 2 2 3 3 ? r ? p
stps30l45c ordering information doc id 8002 rev 4 11/12 3 ordering information 4 revision history table 10. ordering information order code marking package weight base qty delivery mode stps30l45ct stps30l45ct to-220ab 2g 50 tube stps30l45cg stps30l45cg d 2 pa k 1.8g 50 tube stps30l45cg-tr stps30l45cg d 2 pa k 1.8g 500 tape and reel stps30l45cw stps30l45cw to-247 4.4g 30 tube stps30l45cr stps30l45cr i 2 pa k 1.4g 50 tube stps30l45cfp stps30l45cfp to-220fpab 1.9 g 50 tube table 11. document revision history date revision changes jul-2003 3b previous issue 13-oct-2010 4 added paragraph above ta bl e 6 and updated i 2 pak dimensions in ta b l e 6 . updated to-247 dimensions in ta bl e 9 .
stps30l45c 12/12 doc id 8002 rev 4 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2010 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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